关键词:
.mitigation
stress analysis
lamina
SMA wires
composite plate
post-buckling
alloy hybrid
Local buckling
ECTE
SMA material
SMAHC layer
SMAHC plates
central cutout
摘要:
In this study, the numerical model of a shape memory alloy hybrid composite (SMAHC) plate was constructed. The model was based on the effective coefficient of thermal expansion (ECTE) model of the shape memory alloy (SMA) material. The embedded SMA wires were modeled as an integrated composite layer in conjunction with the host composite lamina. The tailored design feature of laminated composite plates allows the flexibility of orienting the SMAHC layer along different directions. The response of the SMAHC plates with and without a central cutout, having certain geometric imperfections, subjected to an initial in-plane compressive loading and a subsequent elevated thermal load, were investigated numerically and experimentally. It was established that the positive attribute of the SMA material could be used to successfully suppress the post-buckling deflection of the SMAHC plate under an elevated temperature, when the SMA wires were properly oriented. The variation of stress concentration around the cutout of the SMAHC plate was also investigated. It was found from this study that the orientation of SMA wires had a significant influence on the suppression of the lateral deflection. The extent of such a positive attribute was found to be influenced by the boundary condition of the SMAHC plate.