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关键词： 机电控制工程   自动化控制技术   PLC   变频器   嵌入式微控制器  

摘要： 随着科学技术的发展与创新,自动控制技术的广泛应用使得我国企业的生产效率和产品质量有了显著的提高,对企业的长远发展战略目标的达成有着积极的促进作用。工业创新背景下,在机电控制工程这一专业领域中,自动控制技术中的自动化控制功能,较传统的机电自动化控制水平有显著提升,促进了我国机电工程领域的整体发展。文章介绍了机电控制领域的发展历程,概述了机电控制工程中的自动控制技术,梳理和分析了工业创新背景下机电控制工程对自动控制技术的需求与应用。

关键词： 碳化硅   双极型   导通电阻   关断损耗  

摘要： 碳化硅(SiC)宽禁带半导体材料是目前电力电子领域发展最快的半导体材料之一。绝缘栅双极晶体管(IGBT)是全控型的复合器件,具有工作频率高、开关损耗低、电流密度大等优点,是高压大功率变换器中的关键器件之一。但SiC IGBT存在导通电阻高、关断损耗大等缺点。针对上述挑战,对国内外现有的新型SiC IGBT结构进行了总结。分析了现有的结构特点,结合新能源电力系统的发展趋势,对SiC IGBT的结构改进进行了归纳和展望。

关键词： 课程思政   控制学科   研究生   线性系统   最优控制  

摘要： 在控制学科“线性系统与最优控制”课程教学中融入课程思政，对培养研究生的家国情怀、激发使命担当、提升科研 思维、培塑学术精神，提升控制学科研究生人才培养水平具有重要现实意义，是落实立德树人、为战育人的重要举措。 本文全面论述了“线性系统与最优控制”课程思政建设的重要意义，深入剖析了课程思政建设所面临的现实问题，详 细列举了课程思政教学改革的具体措施，在明确课程教学目标、厘清课程内容主线、构建课程思政体系、挖掘课程思 政元素、优化课程实践考核等方面进行实践探索，并取得良好的教学效果。

关键词： IGBT   反向电动势   滤波   安全性  

摘要： 为了解决IGBT在关断过程中由于负载回路存在感性,IGBT集电极或发射极产生反向电动势导致IGBT被过压击穿的问题,本文提出使用RDC滤波电路进行电压尖峰有效滤除的设计理念。通过两路滤波电路对电压尖峰进行吸收并且不会影响IGBT原有的接通关断时间,可有效地保护IGBT不会在反向电动势所产生的电压尖峰下击穿。同时本设计也可以应用于其他功率器件的接通关断滤波电路中,提高了功率器件的安全性。

关键词： Boost变换器   SiC模块   IGBT模块   热损耗  

摘要： 针对Boost变换器中SiC(碳化硅)与IGBT模块热损耗问题,给出了Boost电路中功率模块热损耗的估算方法,并提供了具体的估算公式。以30 kW DC/DC变换器为研究对象,对功率模块在不同工作频率下的损耗进行了理论计算、PLECS仿真和试验验证对比分析。PLECS仿真和试验验证的结果不仅证明了估算公式的正确性,还直观的体现了SiC和IGBT两类模块在不同开关频率下工作的热损耗趋势。从文中可以看出,使用SiC替代IGBT可以显著地提高变换器的工作频率和功率密度。

关键词： 高绝缘   IGBT驱动供电变压器   电动汽车  

摘要： 随着新源能电动汽车普及率越来越高,产品的技术越来越成熟和产品的质量稳步提升,产品价格的压力也日益突显出来。为进一步提升产品的性价比并结合目前市场需求研发了一款高性价比的电驱IGBT驱动供电变压器,产品将广泛应用于电动汽车的电驱系统。这结构同时也适用于对空间有特别要求的场合,如高绝缘的驱动变压器,小功率反激变压器,小功率推挽变压器等。

关键词： 欧式行车   变频器   调试检修  

摘要： 文章着重研究欧式行车用变频器参数优化调整及故障检修。以一种变频器为例,结合欧式行车的具体特点,阐述了变频器在欧式行车应用中参数优化调整及针对运行中出现的故障维修提出处理方案。

关键词： Logic gates   Insulated gate bipolar transistors   Voltage measurement   Plasmas   Current measurement   Plasma measurements   Inductance   Insulated gate bipolar transistor (IGBT)   plasma   short-circuit   TCAD-simulation  

摘要： The second type of short-circuit (SC II) of an insulated gate bipolar transistor (IGBT) considering the plasma is thoroughly studied in this article. The measurement and device simulation were performed for 1.2 kV IGBTs. Since the SC II is the failure during the IGBT conduction mode, the existing plasma within the IGBT plays an important role in IGBT SC II behavior. The first focus of this article is to understand the composition of the current peak at the beginning of the SC II, which is produced by the Miller-effect during the desaturation process and the sweep-out of the internal plasma. Further, the induced voltage caused by the current decay after the current peak is investigated. The interaction between current decay and the IGBT internal physical mechanism is discussed under different test conditions.

关键词： Mathematical models   Computational modeling   Couplings   Estimation   Atmospheric modeling   Partitioning algorithms   Thermal conductivity   Compact thermal model   coupled system   interface   loosely coupled algorithm   partition decoupling  

摘要： This letter proposes a partition decoupling algorithm for the compact thermal model to reduce the computation burden in the multichip insulated gate bipolar transistor modules. As a typical coupled system, the compact thermal model is split into separate thermal models with several shared interfaces. The interface data, coupling power loss, coming from the previous time step is used to calculate the real temperature in the current time step. The proposed algorithm transforms the spatial coupling of the compact thermal model into the temporal coupling. Furthermore, based on the proposed partition decoupling algorithm, some more loosely coupled algorithms are also designed. Finally, both simulation and experiment are conducted to verify three loosely coupled algorithms.

关键词： Current measurement   IGBT   measurement error   multiple chips   printed-circuit board Rogowski coil (PCB RC)  

摘要： Unbalance of transient currents of multiple chips inside press-pack insulated-gate bipolar transistor (PP IGBT) results in degrading operation and even device damage. Chip currents measurement plays an essential role to understand and solve this problem. Printed-circuit board Rogowski coil (PCB RC), as a small, noninvasive, and high bandwidth current sensor, is very suitable for this application. However, PCB RC integrated with multiple Rogowski coils (RCs) is still difficult to be applied to measure the current of multiple chips in press pack IGBT device because of the low measurement accuracy due to the large interference. In this letter, a high accuracy PCB RC with ten rectangular RCs inside PP IGBT is proposed to measure ten chip currents at the same time. Different from single RC measuring single chip current, the interference of adjacent chip currents has to be considered, and is reduced to 0.6% by optimizing the turns arrangement and lead wires of RCs. The noise of cross talk of adjacent RCs is 1.7% by decreasing the capacitance coupling between RCs. Shielding layers and grounding patter of lead wires for ten RCs are proposed to eliminate the interference of collector voltage. The experiment of transient process of ten chips verifies the effectiveness of proposed PCB RC, and measurement error is only 1.8%.