关键词:
IGBT module
Bond wire aging
Gate voltage
Ringing
Frequency characteristics
摘要:
Aging monitoring of IGBT modules in power converters not only effectively improves system operational reliability, but also significantly reduces maintenance costs. This paper proposes a novel method for monitoring bond wire aging in IGBT modules based on the ringing frequency characteristics of the turn-on gate voltage. Initially, based on the turn-on characteristics of IGBT module and equivalent circuit model, this paper systematically analyzes the reasons for turn-on gate voltage ringing, and points out that the ringing frequency can be used as an indicator to reflect the aging of bond wires. Then, experimental validation of the proposed monitoring strategy was conducted on a buck converter testbed, with comprehensive analysis of operational impacts induced by DC-link voltage variations, gate resistance selection, and junction temperature fluctuations. Finally, this work presents a bond wire degradation monitoring scheme based on gate ringing frequency threshold analysis. The experimental results show that the voltage ringing frequency at the gate Miller plateau of the IGBT module decreases with the aging of the bond wires. The method is non-invasive, and achieves decoupling of the junction temperature using a set threshold.